Precision In Every Layer. Confidence At Every Stage.
From wafer development to final test, every layer of your semi-conductor device depends on accuracy and control. Vitrek delivers test and measurement solutions that enable you to better monitor, verify and optimize every step in the process– without slowing production or compromising quality.
With scalable platforms for metrology, displacement sensing and electrical safety testing, Vitrek has helped scores of manufacturers build better semiconductors– one flawless layer at a time. Here are a few examples of how we do it.
Semiconductor Wafer Metrology
- Monitoring wafers during preparation stages to check thickness for compliance with minimal bow, warp, and total thickness variation (TTV).
- In-process monitoring of solar/photovoltaic wafers for multi-channel thickness, TTV, and bow measurement.
- Ultrasonic, non-destructive inspection of wafers for potential flaws or manufacturing defects.
Semiconductor Test & Characterization
- Operational testing and characterization of packaged semiconductor devices.
- Software utilized in high-speed PASS/FAIL testing systems.
- Signal simulation for calibrating data acquisition systems and providing precision voltages for device testing.
- Real-time acquisition and analysis of storage media read-and-write head signals in manufacturing.
- Real-time ultrasonic characterization of semiconductor die adhesion in manufacturing.
Semiconductor Fabrication Capital Equipment
- Sensors used in the high-resolution focusing of complex lens systems in photolithography tools.
- Sensors utilized to deliver precise measurements of displacement, active vibration, position, and distance.
- Digitizers used in real-time process control for characterization of fabrication processes, enabling fast device control loops with short data latency.
- Design and production testing in a wide range of fabrication gear.
Applications
Lithography Optics Position Focus
Wire Bonding
GaAs Substrate Thickness Measurement
Semiconductor Wafer Lapping and Displacement Measurement
LED SUBSTRATE THICKNESS
Thickness and TTV of Semiconducting Wafers
Wafer Measurement – Ungrounded
Measuring Glass wafer thickness with a Proforma 300i
Displacement Measurement by Fiber Optics
MicroTrak 4 Over a LAN for Ethernet Signaling
Products
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High-Speed Digitizers
GaGe high-speed digitizers provide ultra-fast sampling, deep memory, and low-latency processing for precise semiconductor testing and process monitoring.
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