Blogs
Wire Bonding
Wire Bonding Semiconductor Wire Bonding Level Description Introduction:  Machine automation frequently involves measuring small distances extremely accurately. Wire Bonding is one such application with some challenging requirements. A ‘normal’ wire bond consists of gold wire bonded to a substrate (PC Board) and an integrated circuit. Wire size varies between eighteen and fifty microns, with twenty-five microns being the ‘standard’; pad sizes are typically between seventy-five and one hundred microns wide. Space between two pads is generally one hundred microns. The width of the actual bond is generally 1.2 to 2.5 times [...]
GaAs Substrate Thickness Measurement
GaAs Substrate Thickness Measurement Semiconductor Gaas Substrate Thickness Measurement Thickness Description Measuring Thickness of Wafers with Different Chemistries Introduction:  Silicon wafers are ordinarily highly conductive and easy to measure with standard capacitive displacement sensors (See MTI's Proforma 300i). Measuring the thickness of GaAs wafers that have high bulk resistivity (>10k Ohm/cm) is a little more difficult because the wafers act as non-conductive insulators in a capacitive sensor's measuring field. Fortunately, MTI has a solution to this problem. Solution:  It’s possible to measure the thickness and TTV of high resistivity semiconducting [...]
Photolithography Using Capacitance Sensors
Photolithography Using Capacitance Sensors Semiconductor Photolithography Using Capacitance Sensors Positioning Description When it comes to photolithography, how accurate are our sensors? Accurate enough to measure this: ​   Photo by D. Carr and H. Craighead, Cornell The world's smallest guitar is 10 micrometers long -- about the size of a single cell -- with six strings each about 50 nanometers, or 100 atoms, wide. Made by Cornell University researchers from crystalline silicon, it demonstrates a new technology for a new generation of electromechanical devices. Even the world’s smallest guitar’s 2 [...]
MTI Video: Wafer Inspection & Metrology Startup (Proforma 300iSA)
https://youtu.be/mawagL6Yg3U
MTI Video: Wafer Inspection and Metrology Tutorial (Proforma 300i)
https://www.youtube.com/watch?v=nGkbpG2sz_k Learn More Download this brochure to learn more about the Proforma 300i wafer measurement system for semiconducting and semi-insulating wafers. This article in AZO Sensors also provides information.
New Video from MTI! Closed-loop System to Monitor and Control Conductive Film Thickness During Manufacturing
Closed-loop System to Monitor and Control Conductive Film Thickness During Manufacturing This animation demonstrates how Accumeasure with capacitance probes can be used as a solution to measure and control conductive film thickness in a production line where these measurements can be fed back to a controller which adjusts the roller(s) to increase or decrease the gap to keep the film’s thickness within specification. The MTI Instruments Capacitive system has greater than 100 nm resolution and 1um accuracy. This solution is appropriate for measuring the following: EV battery plate thickness Non-woven conductive material thickness Conductive film thickness Roll-to-roll conductive [...]
WAFER MEASUREMENT – UNGROUNDED
Industry Semiconductor Applications Wafer Measurement – Ungrounded Measurement Type Metrology Description MTI Instruments Inc. has developed a thickness measurement device that eliminates the effect of varying target conductivity. Called the Push-Pull probe, it’s a unique version of the AccumeasureTM amplifier series. This special design provides accurate surface information for wafer bow and warp. Bow is the deviation of the center point of the median surface of a free, un-clamped wafer from the median surface to the reference plane. Where, the reference plane is defined by three corners of equilateral triangle. This [...]
PBS-4100+ ROI Calculator
PBS 4100+ ROI Calculator Find Out How Much You Can Save There are many advantages to using the PBS-4100+ for troubleshooting or simply keeping your turbine engines running smoothly. The amount of time and money your organization will save is significant in times where keeping your operational costs low, without sacrificing safety, is paramount. PBS-4100+ Versus "Three Shot" method When an airplane comes in with a squawk for an abnormally high vibration level, it can be a frustrating experience for maintenance techs to identify and address the problem. [...]
PHOTOLITHOGRAPHY USING CAPACITANCE SENSORS
Industry Semiconductor Applications Lithography Optics Position Focus Measurement Type Positioning Description When it comes to photolithography, how accurate are our sensors? Photo by D. Carr and H. Craighead, Cornell - The world’s smallest guitar is 10 micrometers long — about the size of a single cell — with six strings each about 50 nanometers, or 100 atoms, wide. Made by Cornell University researchers from crystalline silicon, it demonstrates a new technology for a new generation of electromechanical devices. Even the world’s smallest guitar’s 2 micron [...]
Case-In-Point: High-Accuracy Capacitive Thickness Measurement Optimizes Li-Ion EV Battery Plate Qualities GalleryCase-In-Point: High-Accuracy Capacitive Thickness Measurement Optimizes Li-Ion EV Battery Plate Qualities
Application Notes-MTI, Brand-MTI, Industry-Automotive, Industry-Battery, Industry-Compliance Testing, Industry-Consumer Products, Industry-Electronics, Industry-Manufacturing, Products-MTI-Capacitance, Z-REPUB, z1
Case-In-Point: High-Accuracy Capacitive Thickness Measurement Optimizes Li-Ion EV Battery Plate Qualities
High-Accuracy Capacitive Thickness Measurement Optimizes Li-Ion EV Battery Plate Qualities EV Battery manufacturers need to measure EV battery plate thickness with a high degree of precision (repeatable <2um accuracy and resolution) to optimize manufacturing efficiencies while maintaining uniform cell capacity and minimizing waste. The MTI Accumeasure System provides an effective means of monitoring plate thickness achieving sub 2um accuracy with high repeatability Introduction The rapidly expanding demand for electric vehicles is driving advances in the production of rechargeable cells that comprise the first stage in the composition of EV battery packs. Individual Li-Ion cells are combined to [...]