Demand for SiC wafers is growing rapidly and production needs to keep up.   Speeding up production can result in higher defect rates without the proper inspection equipment in place during the R&D process, where poor verification of your process tools can dramatically reduce yield. MTI Instruments 300iSA system can help measure TTV, flatness, bow and warp of up to 20 wafers per hour. Our solution helps you perform wafer inspection verifications at scale and increases the throughput of your production yield as the demand grows for 100-200mm diameter wafers. Finding defects at volume can be difficult, but MTI’s superior [...]