Blogs
Why Disc Geometry Matters In Wafer Production GalleryWhy Disc Geometry Matters In Wafer Production
Application Notes-MTI, Brand-MTI, Industry-Consumer Products, Industry-Electronics, Industry-Manufacturing, Industry-Semiconductor, Industry-Semiconductor-MTI, News-MTI-Metrology, Products-MTI-Semiconductor/Metrology, z1
Why Disc Geometry Matters In Wafer Production
This is the first of three articles in Semiconductor Wafer Measurement for Increased Profitability. The second article examines the cost of failing to inspect semiconductor wafers. The third article describes the benefits of using semi-automated, fully-automated, and manual systems for wafer metrology and inspection. Semiconductor wafers are cut from cylindrical silicon crystals, or ingots. The flatness of these disc-shaped wafers is controlled to tight tolerances to ensure that the entire wafer surface is suitable for integrated circuit (IC) production. If disc geometry is out-of-spec after cutting, it may be possible to reprocess the wafer. Cutting is only the first [...]
MTI Instruments Announces Multi-Million Dollar U.S. Air Force Contract
NEW YORK - (NewMediaWire) - January 07, 2022 - MTI Instruments, a manufacturer of precision tools and testing equipment for electronics, aviation, automotive, power and other industries, today announced a multi-year and multi-million-dollar contract with the U.S. Air Force (USAF).The total value over the life of the contract is anticipated to be well over $10 million. The contract includes a one-year base with four extension years and reflects a reaffirmation of the 24-year relationship prior to this award. The USAF has awarded MTI Instruments this contract for the supply of its turbofan jet engine vibration analysis and balancing solution, [...]
MTI Instruments Enters Advanced Qualification Stage for Electric Vehicle Battery Measurement Device with Several Major Automotive OEM Manufacturers GalleryMTI Instruments Enters Advanced Qualification Stage for Electric Vehicle Battery Measurement Device with Several Major Automotive OEM Manufacturers
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MTI Instruments Enters Advanced Qualification Stage for Electric Vehicle Battery Measurement Device with Several Major Automotive OEM Manufacturers
NEW YORK, December 16, 2021 – MTI Instruments division, a manufacturer of precision tools and testing equipment for electronics, aviation, automotive, power and other industries, today announced that it has entered into the advanced qualification stage for its electric vehicle (EV) battery measurement device with several major automotive OEM manufacturers. Moshe Binyamin, President and CEO of MTI Instruments commented, “We committed to shareholders that we would communicate with them as we began to get traction in the growing and large EV Battery manufacturing segment. I am pleased to report, we are gaining serious traction.” Binyamin further added, “In fact, [...]
MTI Instruments Announces Record $1.4 Million Order with Global Industrial Manufacturer
NEW YORK, Dec. 15, 2021 (GLOBE NEWSWIRE) -- via NewMediaWire -- MTI Instruments division, a manufacturer of precision tools and testing equipment for electronics, aviation, automotive, power and other industries, today announced a $1.4 million order with a global industrial manufacturer. The contract also includes a 14-year ongoing maintenance and support component representing another high-value contract win with recurring revenue. This repeat order stems from a multi-year customer relationship and is for MTI’s Block Gage measurement device that allows this top-tier global industrial manufacturer to perfectly machine ball pistons that require extremely precise accuracy for high power transmissions. MTI uses [...]
Exploring the Different Types of Aircraft Vibrations GalleryExploring the Different Types of Aircraft Vibrations
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Exploring the Different Types of Aircraft Vibrations
There are two main types of aircraft vibrations: normal and abnormal. Normal vibrations regularly occur when an airplane is in flight and during takeoff and landing. These oscillating or reciprocating motions do not indicate potential defects with the aircraft or its engines and can be explained by routine operations such as flying through turbulence or extending or retracting the landing gear. With abnormal vibrations, a mechanical defect or condition is to blame. If this is not corrected, further damage and even catastrophic failure may occur. What are the causes of aircraft vibrations? The causes of aircraft vibrations include: engine [...]
Non-Contact Displacement Sensors for Detection and Measurement
Non-contact sensors detect or measure a physical property without making direct contact with the target, the object that is being monitored or measured. They are used to measure physical properties such as thickness, proximity, displacement, or distance. To obtain readings, non-contact displacement sensors emit a form of energy and may use capacitance, fiber optic, or laser triangulation technologies. By contrast, contact sensors must touch the target and often rely upon mechanical movement. Non-Contact Sensors vs. Contact Sensors Non-contact sensors are faster, especially for applications with high sampling rates, and won’t dampen the motion of a target. They can also [...]
How Often Should Vibration Analysis Be Performed?
How Often Should Vibration Analysis Be Performed? Once a customer takes delivery of a PBS system and learns how to use it, the next logical question is: “How often should we use it?” At a minimum, your approved maintenance program (whether it’s a program developed by your operation, or the maintenance procedures outlined by the engine/airframe manufacturer) will tell you about the intervals at which to perform a vibration analysis. Usually, there is a procedure to specify how an engine vibration analysis and balance need be only completed when squawked by a pilot or after the completion of maintenance work [...]
Using Capacitance Sensors for Non-Conductive Material Measurement GalleryUsing Capacitance Sensors for Non-Conductive Material Measurement
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Using Capacitance Sensors for Non-Conductive Material Measurement
Non-Conductive Material Measurement with Capacitance Sensors Capacitance sensors are non-contact devices that can be used to obtain position, thickness, and dynamic measurements with a high degree of precision, accuracy, and resolution. Capacitive measurement is used with electrically-conductive materials such as metals but can also be used to measure non-conductive materials such as glass, sapphire, and many plastics. Even if a non-conductive material is relatively inexpensive (such as closed cell foam), manufacturers want to avoid errors that can result in significant waste across high volumes. Importantly, capacitance measurement is also used with semi-insulating materials such as gallium arsenide (GaAs) and [...]
Why Demand for SiC Wafers is Hot and Durable GalleryWhy Demand for SiC Wafers is Hot and Durable
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Why Demand for SiC Wafers is Hot and Durable
Why Demand for SiC Wafers is Hot and Durable Pardon the pun, but SiC wafers are a hot item for high-temperature applications. Silicone carbide (SiC), a semiconductor containing both silicon and carbide, withstands temperatures up to 2700°C. Carborundum, as this durable ceramic is also known, finds additional applications in bulletproof vests, extrusion dies, sandpaper, and high-performance disc brakes. In electronics, SiC materials are used with light-emitting diodes (LEDs) and detectors. In the semiconductor industry, a market where interest is red-hot, SiC wafers are used in electronic devices that operate at high temperatures, high voltages, or both. Examples include electric [...]
Wafer Stress Analysis Using the 300iSA
Wafer Stress Analysis Using MTI Instruments Proforma 300iSAWafer processing involves several stages that may translate into mechanical alterations. Sometimes these alterations can cause deformities that render the wafer either unusable or that put it marginally close to not being usable. To determine this, stress analysis can be used.The Proforma 300iSA wafer characterization tool provides a software capability in which a wafer can be analyzed prior to processing and then after processing. The tool then evaluates how the wafer changed and hence, provides the resulting stress analysis.The software expects the customer to provide the material elasticity constants and to define them [...]