Blogs
Press Release: QT Enterprise Electrical Safety Software Manages and Records Test Procedures GalleryPress Release: QT Enterprise Electrical Safety Software Manages and Records Test Procedures
Brand-Vitrek, Industry-Cable Test, Industry-Compliance Testing, Industry-Consumer Products, Industry-Education, Industry-Electronics, Industry-Government/Military, Industry-Lighting, Industry-Manufacturing, Industry-R&D, Industry: Transportation, News-Product Updates, News-Vitrek, Press Releases-Vitrek, Products-Vitrek-QT, z1
Press Release: QT Enterprise Electrical Safety Software Manages and Records Test Procedures
Vitrek’s QT Enterprise Electrical Safety Software Manages and Records Test Procedures Platform facilitates electrical safety test sequence setup, report creation and data archiving; SQL database of test procedures and results accessible from multiple PCs, bar coding feature enables accurate application of production test sequences. […]
How to Implement a Complete Digital Closed Loop Control System
Co-authored by Don Welch, Director of Engineering and Business Development Cory Bufi, Software Engineer Isaac Abbott,Product Innovation Engineer – PBS Group Request Whitepaper Today’s electronic designs often call for reasonably fast and precise positioning of miniature components for process deposition elements such as ink jet nozzles, 3D printing elements etc. And as process control moves from mm positioning to micron to sub-micron positioning it becomes necessary to monitor and control positioning actuators such as piezo flexure stage and voice coil motors. Open loop control of the positioning stage may have been adequate in non-precision applications but piezo electric [...]
Proforma 300i SA Video Shows Semiconductor Metrology GalleryProforma 300i SA Video Shows Semiconductor Metrology
Brand-MTI, Industry-Compliance Testing, Industry-Consumer Products, Industry-Electronics, Industry-Manufacturing, Industry-R&D, Industry-Semiconductor, Industry-Semiconductor-MTI, News-MTI-Metrology, News-Product Updates, Press Releases-Vitrek, Products-MTI-Semiconductor/Metrology, Videos-MTI, Videos-MTI-Manual Semiconductor Metrology System, Z-REPUB, z1
Proforma 300i SA Video Shows Semiconductor Metrology
MTI Instruments, a worldwide leader in precision measurement solutions, has released a YouTube video that shows how its Proforma™ 300i SA semi-automated measurement tool measures silicon carbide wafers for semiconductors. George Relan, MTI’s Global Director of Sales, demonstrates how the desktop metrology system provides non-contact full wafer scanning and 3D mapping of measurement features such as thickness and shape. MTI’s video also shows how the Proforma 300i SA interfaces with an external computer and provides powerful Windows-based software for analysis and reporting. By utilizing MTI push/pull technology, the Proforma 300i SA doesn’t require the semiconductor wafers to have a [...]
3D Integrated Circuits Use Capacitive Sensing to Ensure Coplanarity Gallery3D Integrated Circuits Use Capacitive Sensing to Ensure Coplanarity
Application Notes-MTI, Brand-MTI, Industry-Consumer Products, Industry-Electronics, Industry-Manufacturing, Industry-Semiconductor, Industry-Semiconductor-MTI, Industry-Sensors, Z-REPUB, z1
3D Integrated Circuits Use Capacitive Sensing to Ensure Coplanarity
Three-dimensional (3D) integrated circuits (ICs) feature silicon wafers and dies that are stacked vertically for improved device performance. By using the Z-axis, 3D ICs can overcome the power and footprint limitations associated with two-dimensional (2D) integrated circuits. Yet 3D ICs need coplanar surfaces to contact all of the pads, pins, and pillars. To determine coplanarity, semiconductor manufacturers measure the angle and gap between two planes. Bonding tool actuators use these measurements to adjust components and ensure that all device pins and solder balls reside on the same geometric plane. This process, active parallelism compensation, promotes proper bonding without residual [...]
About Wafer Bow And Warp Measurement Systems
Semiconductor/Solar Wafer Bow And Warp Metrology/Surface About Wafer Bow And Warp Measurement Systems Thickness Measurement for Metrology Systems ASTM F657: The distance through a wafer between corresponding points on the front and back surface. Thickness is expressed in microns or mils (thousandths of an inch). Total Thickness Variation (TTV) ASTM F657: The difference between the maximum and minimum values of thickness encountered during a scan pattern or series of point measurements. TTV is expressed in microns or mils (thousandths of an inch). Figure above shows a wafer placed between two non-contact [...]
Laser Thickness Gauge System Principles
Microtrak™ 3 TGS The Microtrak™ 3 TGS system is specifically designed for thickness applications utilizing two lasers. The product can be used in a standalone configuration or easily interfaced with PLCs and PCs. Each module contains an integral LCD display and keypad for setup and display of measurements. A USB serial port also allows control by a laptop computer. Basic PLC or control input/output is provided by discrete digital I/O lines or a Modbus® interface. Laser Triangulation Principle The Microtrak™ 3 TGS system uses the principle of laser triangulation to perform a one dimensional [...]
MICROTRAK 4: 1D Laser Displacement Sensor
Accurate and repeatable displacement measurements from highly reflective to dull surfaces Request a Quote Download Microtrak 4 Brochure Compact digital laser displacement sensor head with stable and accurate measurements The latest 1D laser displacement sensor from MTI provides excellent speed and accuracy for even the most difficult applications and provides data output and power through a single USB cable. The MicroTrak 4 is the ultimate 1D laser sensor for measuring height, thickness, displacement, vibration, and more, with a sensor frame rate of 40k Samples/sec. and linearity of 0.03% FSO (Full Scale Output) accuracy and [...]
Fiber Optic Sensor Principles
The Fotonic Sensor™ is a non-contact instrument, which uses the fiber optics lever principle to perform displacement measurement, vibration analysis and surface-condition measurements. The Fotonic Sensor transmits a beam of light through a flexible fiber-optic probe, receives light reflected from a target surface, and converts this light into an electrical signal proportional to the distance between the probe tip and the target being measured. A simplified example of the fiber optic principal is shown in Figure 2. The output signal voltage from the fiber optic sensor is then used to determine position, displacement, vibration amplitude, frequency and waveshape of a [...]
Common Test and Calibration Uses of the 1510A Portable Signal Generator
Introduction As one of the most versatile and powerful hand-held signal generators on the market, the 1510A is a two-channel, battery-powered, microprocessor-controlled direct digital signal generator. It has an average battery life of 3 hours of continuous use. Weighing in at under two pounds, makes it ideal for use in the field. There are many different ways this sophisticated device can be leveraged to perform precise test and calibration of equipment, wires, cables, sensors and much more. Use Case #1 | Sensor Simulation You can simulate sensors during system development, bring-up, and test. Often during [...]
Selecting a Displacement Sensor / Measuring System
Capacitive displacement sensors Capacitive displacement sensors are non-contact devices that are used for measurements at a high-resolution. It can also be used to check the position of any conductive object as well as measure the width or density of non-conductive materials. Capacitive displacement sensors have a large variety of uses including precision thickness measurements, assembly line testing, assembly metrology, and semiconductor processing. Capacitive displacement sensors can be found in manufacturing facilities all around the globe. There’s more to selecting the proper type of displacement sensor and measurement system than meets the eye. To select the appropriate type of device [...]