Blogs
Semiconductor Wafer Lapping and Displacement Measurement
Semiconductor Wafer Lapping and Displacement Measurement Semiconductor Semiconductor Wafer Manufacturing Displacement Description Semiconductor Wafer Lapping and Displacement Measurement This application note explains how MTI's Accumeasure technology was used with a lapping machine to measure displacement (wafer material removal) and determine the new semiconductor wafer thickness. Changes in electrical capacitance (displacement) were measured and then directly converted into a 24-bit digital reading to obtain precise digital thickness measurements. During lapping, a wafer of known start thickness is placed on a rotary lapping table. The backside of the wafer faces downward and [...]
Measuring Piezoelectric Properties with Fiber Optics
Measuring Piezoelectric Properties with Fiber Optics Research & Development Piezoceramic, 1-3 Pzt / Polymer Composite And Pvdf Film Amplitude Description Figure 4: Fiber Optic MTI 2100 Fotonic Sensor Introduction Researchers from the University of Arizona used the MTI-2000 Fotonic Sensor to measure the indirect piezoelectric properties (d33) and strain of bulk ferroelectric and thin film samples. The team then correlated these results with data acquired from direct piezoelectric effect measurement. By comparing data sets, the researchers concluded that the MTI-2000 provides a useful optical technique for measuring the [...]
Thickness Gauge Measurement With Conductive Wafers and Thin Films
Thickness Gauge Measurement With Conductive Wafers and Thin Films Consumer Electronics Electronics Parts Profiling Thickness Description Using MTI's capacitive thickness gauge Proforma 300i with conductive wafers and thin films G = (a+b+t1+t2 ) Where G is the fixed gap between two probes When making the thickness measurement t2 can appear as t2 (film thickness) when it is a conductor, or 0 thickness when t2 is just air. So t2 will vary between the actual film thickness t2 if it's a conductor all the way down to 0 thickness if [...]
Two Ways to Measure Stamped Sheet Metal Thickness
Two Ways to Measure Stamped Sheet Metal Thickness Solar, Semiconductor Measurement of Ungrounded Targets Thickness, Metrology Description Learn how to measure stamped sheet metal thickness with MTI's Digital Accumeasure, a high-precision capacitance measurement system with nanometer accuracy and stability. Problem High silicon steels are alloys of iron and silicon that are easily magnetized and demagnetized. They can be supplied as sheet metal with a very thin dielectric coating. As this application note explains, precise measurements of stamped samples with a dielectric coating of ~ 10µi were needed. Solution MTI’s Digital [...]
Two Ways to Measure EV Battery Plate Thickness
Two Ways to Measure EV Battery Plate Thickness Animation showing a system setup used to measure the thickness of thin conductive films such as electric vehicle (EV) battery electrodes. Description Learn how to measure EV battery plate thickness with MTI’s Digital Accumeasure, a high-precision capacitance measurement system with nanometer accuracy and stability. Problem Lithium battery plates for electric vehicles consist of lithium ion compounds applied to either a copper plate substrate (cathode plate) or an aluminum substrate (anode plate). The plates are approximately 100-200 um thick ( .004 - .008 inch). [...]
Dynamic Measurement of Small Oscillatory Motions
Dynamic Measurement of Small Oscillatory Motions Research & Development Piezoelectric Stack Motion Fotonic Systems Displacement Description This application note describes the measurement of a very small oscillatory motions (nanometers) produced by a piezo electric device with the MTI-2100 and the MTI-2032RX high-resolution module. Fotonic™ sensors from MTI Instruments are ideal for making dynamic measurements of very small oscillatory motions. Using the MTI-2100 Fotonic Sensor with a spectrum analyzer, angstrom level measurements are possible. Would you like to know more? Okay, let's set up some basic equipment and get started. Piezo [...]
Interfacing MTI’s Digital Accumeasure to Measurement Computing’s DASYLab with Modbus
Interfacing MTI's Digital Accumeasure to Measurement Computing's DASYLab with Modbus Interfacing MTI's Digital Accumeasure to Measurement Computing's DASYLab with Modbus Displacement Description Laptop running MC DASYLab1 © and MTI Digital Capacitance sensor over Modbus TCP/IP Measurement Computing's DASYLab data acquisition software is easy to use and allows measuring with multiple system sensors (analog and digital). You can plot the results of multiple sensors versus time or encoder position and store the data with DASYLab. This application note describes how to interface MTI's Digital Capacitance Sensor over Ethernet TCP/IP. The DASYLab Modbus [...]
Displacement Measurement by Fiber Optics
Displacement Measurement by Fiber Optics Semiconductor, Research & Development 3D IC Construction Displacement, Vibration Description The Fotonic™ Sensor is a non-contact instrument which uses the fiber optics lever¬π principle to perform displacement, vibration and surface-condition measurements (Figure 1). The Fotonic Sensor transmits a beam of light through a flexible fiber-optic probe, receives light reflected from a target surface, and converts it into an electrical signal proportional to the distance between the probe tip and the target being measured.¬† The output signal voltage from the fiber optic sensor is then used [...]
MicroTrak 4 Over a LAN for Ethernet Signaling
MicroTrak 4 Over a LAN for Ethernet Signaling Semiconductor, Research & Development 3D IC Construction Distance, Positioning, Displacement Description The MicroTrak 4, which is a USB device, can also be used over a LAN or even CAT 5e/6/7 wiring with additional hardware to convert the USB sensor to Ethernet signaling. The devices required to run over the LAN or direct CAT wire are Icron USB 2.0 Ranger 2301GE-LAN extender system. The MicroTtrak 4 basic software then runs on the host computer.  The LAN does not have to be dedicated; it [...]
Monitor Roller Gaps and Parallelism
Monitor Roller Gaps and Parallelism Industrial Printing, Calendering, Crushing Gap Easy Roller Gap Measurement Ensures Calendering Success Many roll-to-roll finishing processes typically use a calender, or series of hard pressure rollers, to deliver smooth, high-quality products of plastic, textile, or paper (Fig 1). Ensuring a consistent material thickness, however, depends on the ability to monitor, and maintain, a precise gap between rollers. This application note describes a quick and easy means for roller gap measurement. Figure 1: Calender Rollers where consistent gap across the rollers are vital [...]